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F64P30B8E2T085 Даташит - Intel

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F64P30B8E2T085

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102 Pages

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1.1 MB

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Intel
Intel Intel

Introduction
This document provides information about the Intel StrataFlash® Embedded Memory (P30) device and describes its features, operation, and specifications.

Product Features
■ High performance
    — 85/88 ns initial access
    — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
    — 25 ns asynchronous-page read mode
    — 4-, 8-, 16-, and continuous-word burst mode
    — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
    — 1.8 V buffered programming at 7 µs/byte (Typ)
■ Architecture
    — Multi-Level Cell Technology: Highest Density at Lowest Cost
    — Asymmetrically-blocked architecture
    — Four 32-KByte parameter blocks: top or bottom configuration
    — 128-KByte main blocks
■ Voltage and Power
    —VCC(core) voltage: 1.7 V – 2.0 V
    —VCCQ (I/O) voltage: 1.7 V – 3.6 V
    — Standby current: 55 µA (Typ) for 256-Mbit
    — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
■ Quality and Reliability
    — Operating temperature: –40 °C to +85 °C
        • 1-Gbit in SCSP is –30 °C to +85 °C
    — Minimum 100,000 erase cycles per block
    — ETOX™ VIII process technology (130 nm)
■ Security
    — One-Time Programmable Registers:
        • 64 unique factory device identifier bits
        • 64 user-programmable OTP bits
        • Additional 2048 user-programmable OTP bits
    — Selectable OTP Space in Main Array:
        • 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
    — Absolute write protection: VPP= VSS
    — Power-transition erase/program lockout
    — Individual zero-latency block locking
    — Individual block lock-down
■ Software
    — 20 µs (Typ) program suspend
    — 20 µs (Typ) erase suspend
    —Intel® Flash Data Integrator optimized
    — Basic Command Set and Extended Command Set compatible
    — Common Flash Interface capable
■ Density and Packaging
    — 64/128/256-Mbit densities in 56-Lead TSOP package
    — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
    — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
    — 16-bit wide data bus

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Номер в каталоге
Компоненты Описание
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производитель
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