F3L75R07W2E3_B11 Даташит - Infineon Technologies
Номер в каталоге
F3L75R07W2E3_B11
Компоненты Описание
Other PDF
PDF
page
11 Pages
File Size
595.9 kB
производитель
Infineon Technologies
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• Press FIT Contact Technology
• Rugged mounting due to integrated mounting clamps
Electrical Features
• Increased blocking voltage capability to 650V
• Low inductive design
• Low Switching Losses
• Low VCEsat
Typical Applications
• 3-Level-Applications
• Solar Applications
• UPS Systems
Номер в каталоге
Компоненты Описание
PDF
производитель
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with fast Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
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