General Description
Based on a 0.22 µm CMOS process technology, the eX family of FPGAs is a low-cost solution for low-power, high-performance designs. With the automotive temperature grade support (–40ºC to 125ºC), the eX devices can address many in-cabin telematics and automobile interconnect applications. The low-power attributes inherent in antifuse technology make the eX devices ideal for designers who are looking to integrate low-density, power-sensitive automotive applications into a programmable logic solution, enabling quick timeto-market.
   
Features
• 250 MHz Internal Performance, Low-Power Antifuse FPGA
• Advanced Small-Footprint Packages
• Pin-to-Pin Compatibility with eX Commercial- and Industrial-Grade Devices
• Hot-Swap Compliant I/Os
• Single-Chip Solution
• Nonvolatile
• Live on Power-Up
• No Power-Up/Down Sequence Required for Supply Voltages
• Configurable Weak Resistor Pull-Up or Pull-Down for Tristated Outputs during Power-Up
• Individual Output Slew-Rate Control
• 2.5 V and 3.3 V I/Os
• Software Design Support with Actel Designer and Libero® Integrated Design Environment (IDE)  Tools
• Up to 100% Resource Utilization with 100% Pin Locking
• Deterministic Timing
• Unique In-System Diagnostic and Verification Capability with Silicon Explorer II
• Boundary Scan Testing in Compliance with IEEE Standard 1149.1 (JTAG)
• FuseLock™ Secure Programming Technology Prevents Reverse Engineering and Design Theft