FEATURES
● LOW PROFILE PACKAGE
● PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
● IDEAL FOR SURFACE MOUNTED APPLICATION
● GLASS PASSIVATED CHIP JUNCTION
● BUILT-IN STRAIN RELIEF DESIGN
● FAST EFFICIENT RECOVERY TIME FOR HIGH EFFICIENT
● HIGH TEMPERATURE SOLDERING: 250°C/10 SECONDS AT
   TERMINAL
● ROHS

MECHANICAL DATA
● CASE: JEDEC DO-214AA (SMB), MOLDED PLASTIC BODY,
   DIMENSIONS IN INCHES AND (MILLIMETERS)
● TERMINAL: SOLDER PLATED, SOLDERABLE PER MIL-STD-
   750 METHOD 2026
● POLARITY: COLOR BAND DENOTES CATHODE
● WEIGHT:0.093 GRAMS