Features
✦ Batch process design, excellent power dissipation offers better
   reverse leakage current and thermal resistance.
✦ Low profile surface mounted application in order to optimize
   board space.
✦ Low power loss, high efficiency.
✦ High current capability, low forward voltage drop.
✦ High surge capability.
✦ Guardring for overvoltage protection.
✦ Ultra high-speed switching.
✦ Silicon epitaxial planar chip, metal silicon junction.
✦ Lead-free parts meet environmental standards of
   MIL-STD-19500 /228
✦ Suffix "H" indicates Halogen-free parts, ex. ECCSR120L1HR

Mechanical Data
✦ Epoxy : UL94-V0 rated flame retardant
✦ Case : Molded plastic, DO-214AC / SMA
✦ Terminals :Plated terminals, solderable per MIL-STD-750,
   Method 2026
✦ Polarity : Indicated by cathode band
✦ Mounting Position : Any
✦ Weight : Approximated 0.05 gram