FEATURES
* VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
* BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
* SURGE OVERLOAD RATING TO 400 AMPS PEAK
* THRU-HOLE FOR EASY HEAT SINK MOUNTING
* RoHS COMPLIANT