Description
This opto device is specially designed for all applications where the space is very limited and a highly reliable product is needed. Especially for hybrid and SMT.
The solder pads are a very good heat sink, so that high power dissipation is achievable. Best reflective distance: 0.9 mm (paper).

FEATUREs and Benefits
➤ Surface mounting device
➤ Complete ceramic housing
➤ High temperature range
➤ Miniature size
➤ Solder pads conform with
   Mil-Std. 883 B