Features
• Build in Biasing Circuit; To reduce using parts cost & PC board space.
• High forward transfer admittance; (|yfs| = 42 mS typ. at f = 1 kHz)
• Withstanding to ESD; Build in ESD absorbing diode. Withstand up to 250V at C=200pF, Rs=0 conditions.
• Provide mini mold packages; MPAK-4 (SOT-143 var.)