FEATURES
▪ For surface mounted applications
▪ Glass Passivated Chip Junction
▪ Fast reverse recovery time
▪ Ideal for automated placement
▪ Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
▪ Case: SOD-323
▪ Terminals: Solderable per MIL-STD-750, Method 2026
▪ Approx. Weight: 5.48mg / 0.00019oz