FEATURES
● PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● Soldering Temperature: 250 °C maximum
● Mounting Position: Any
● Polarity: Color band denotes cathode
● Weight: 0.6 Ounces (1.8 Grams)