Features:
• Small foot print, surface moutable
• Low forward voltage drop
• High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
• High frequency operation
• Guard ring for enhanced ruggedness and long term reliability
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

APPLICATIONs:
• Disk Drives
• Switching power supply
• Converters
• Free-Wheeling diodes
• Reverse battery protection
• Battery Charging