PRODUCT DESCRIPTION
   AWU6616 addresses the demand for increased integration in dual-band handsets for WCDMA and CDMA networks. The small footprint 3 mm x 5 mm x 1 mm surface- mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs. The package pinout was chosen to enable handset manufacturers to easily route bias to both power amplifiers and simplify control with common mode pins.

FEATURES
• InGaP HBT Technology
• High Efficiency (R99):
   • 37 % @ POUT = +28.1 dBm (Band 1)
   • 38 % @ POUT = +28.7 dBm (Band 5, 6)
   • 24 % @ POUT = +16.5 dBm
   • 8.5 % @ POUT = +8 dBm
• Low Quiescent Current: 4 mA
• Internal Voltage Regulation
• Built-in Directional Coupler
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• RoHS Compliant Package, 260 oC MSL-3

APPLICATIONS
• Band 1 +5, 6 Dual-band WCDMA/HSPA wireless
   devices
• Band Class 0+6 Dual-band CDMA/EVDO
   wireless devices.
• Band Class 0+6 Dual-band EVDO Rev. B
   wireless devices.