PRODUCT DESCRIPTION
AWU6615 addresses the demand for increased integration in dual-band handsets for WCDMA networks. The small footprint 3 mm x 5 mm x 1 mm surface- mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs.

FEATURES
• InGaP HBT Technology
• High Efficiency:
   • 39 % @ POUT = +28.7 dBm
   • 22 % @ POUT = +16.6 dBm
   • 9 % @ POUT = +8 dBm
• Low Quiescent Current: 4.5 mA
• Internal Voltage Regulation
• Built-in Directional Coupler
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• RoHS Compliant Package, 260 oC MSL-3

APPLICATIONS
• Cell & PCS Dual-band Wireless Handsets and
   Data Devices for HSDPA/HSPA networks.