DESCRIPTION
The Accutek AK591024 high density memory modules is a random access memory organized in 1 Meg x 9 bit words. The assembly consists of two 1 Meg x 4 and one 1 Meg x 1 DRAMs in surface mount packages mounted on the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. This packaging approach provides a better than 6 to 1 density increase over standard DIP packaging.

FEATURES
• 1,048,576 x 9 bit organization
• Optional 30 Pad SIM (Single In-Line Module) or 30 Pin leaded
   SIP (Single In-Line Package)
• JEDEC standard pinout
• Common CAS, RAS and WE control for the lower eight bits
• 1024 refresh cycles/16ms
• Separate PCAS control for D9 and Q9
• Power:
   1.650 Watt Max Active (60 nS)
   1.485 Watt Max Active (70 nS)
   1.265 Watt Max Active (80 nS)
   23.5 mWatt Standby (max)
• Operating free air temperature: 0°C to 70°C
• Upward compatible with and AK594096 and AK5916384
• Downward compaitble with AK59256
• Functionally and Pin compatible with AK491024