Features
- Lead less chip form, no lead damage.
- Low power loss, High efficiency.
- High current capability, low VF.
- Plastic package has UL 94V-0.
- Comply with AEC-Q101

Mechanical Data
- Case: Packed with FRP substrate and
            epoxy underfilled.
- Terminals: Pure Tin plated (Lead-Free),solderable
                   per MIL-STD-750, method 2026.
- Polarity: Laser cathode band marking.
- Weight: 0.012 grams (approx).