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A10114-02

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[Laird Technologies]

HIGH PERFORMANCE THERMAL INTERFACE PRODUCTS

The Tgard™ 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric strength are required
A high-tear, cut-through and puncture-resistant product, the Tgard™ 200 is tough and strong. Burrs cause no problems for the material and the pad will not dry out, crack or fail when pressured between mating parts.
The Tgard™ 200 is available in 0.010” (0.25 mm), 0.020” (0.51 mm) and 0.030” (0.75mm) thicknesses.


FEATURES AND BENEFITS
•  High thermal Conductivity of 5.0 W/mK
•  High breakdown voltage of > 6,000 volts
•  Resistant to tears and punctures 
•  UL® 94 V0 rated


APPLICATIONS
•  Audio and video components
•  Automotive control units
•  General high pressure interfaces
•  Motor controllers
•  Power conversion equipment
•  Power semiconductors
  - T0 packages, M0SFETs and IGBTs

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