FEATURES
• For surface mounted applications in order to optimize board space
• Halogen-Free
• Typical maximum temperature coefficent ΔVBR=0.1%xVBR@25°CxΔT
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Excellent clamping capability
• Repetition rate (duty cycle):0.01%
• Fast response time: typically less than 1.0 ps from 0 volts to BV for unidirectional types
• Typical IR less than 2µA above 12V
• High temperature soldering: 260°C/40 seconds at terminals
• Plastic package has Underwriters Laboratory Flammability Classification 94 V-O
• Matte Tin Lead-free plated