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25Q128BVCA Даташит - Winbond

25Q128BVCA image

Номер в каталоге
25Q128BVCA

Компоненты Описание

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74 Pages

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производитель
Winbond
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GENERAL DESCRIPTION
The W25Q128BV (8M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down.


FEATURES
• Family of SpiFlash Memories
   – W25Q128BV: 128M-bit/16M-byte
   – 256-byte per programmable page
   – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
   – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• Highest Performance Serial Flash
   – 104/70MHz Dual Output/Quad SPI clocks
   – 208/280MHz equivalent Dual /Quad SPI
   – 35MB/S continuous data transfer rate
   – Up to 5X that of ordinary Serial Flash
   – More than 100,000 erase/program cycles(1)
   – More than 20-year data retention
• Efficient “Continuous Read Mode”
  – Low Instruction overhead
  – Continuous Read with 8/16/32/64-Byte Wrap
  – As few as 8 clocks to address memory
  – Allows true XIP (execute in place) operation
  – Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
  – Single 2.7 to 3.6V supply
  – 4mA active current, <1µA Power-down current
  – -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
  – Uniform Sector/Block Erase (4K/32K/64K-Byte)
  – Program one to 256 bytes
  – Erase/Program Suspend & Resume
• Advanced Security Features
  – Software and Hardware Write-Protect
  – Top/Bottom, 4KB complement array protection
  – Lock-Down and OTP array protection
  – 64-Bit Unique Serial Number for each device
  – Discoverable Parameters (SFDP) Register
  – 3X256-Byte Security Registers with OTP locks
  – Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
  – 8-pad WSON 8x6-mm
  – 16-pin SOIC 300-mil
  – 24-ball TFBGA 8x6-mm
  – Contact Winbond for KGD and other options

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Номер в каталоге
Компоненты Описание
PDF
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