FEATURES :
* Glass passivated junction chip
* Excellent Clamping Capability
* Fast Response Time
* Low Zener Impedance
* Low Leakage Current
* Fast Response Time : typically less than 1.0ps from 0 volt to BV, Bidirectional less than 10ns
* High temperature soldering guaranteed : 265°C/10 second 0.375",(9.5mm) lead leagth.
* Pb / RoHS Free