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HMC570 Просмотр технического описания (PDF) - Micross Components

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HMC570
MICROSS
Micross Components MICROSS
HMC570 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
v03.0711
HMC570
GaAs MMIC I/Q DOWNCONVERTER
17 - 21 GHz
Pad Descriptions
Pad Number
Function
1
VddRF
2
VddLO2
3
VddLO
4
LO
5
IF1
6
IF2
7
RF
GND
Description
Power supply for RF LNA.
External RF bypass capacitors are required.
Power supply for second stage of LO amplifier.
External RF bypass capacitors are required.
Power supply for first stage of LO amplifier.
External RF bypass capacitors are required.
This pad is AC coupled
and matched to 50 Ohms.
This pad is DC coupled. For applications not requir-
ing operation to DC, this port should be DC blocked
externally using a series capacitor whose value has
been chosen to pass the necessary frequency range.
For operation to DC, this pad must not source /sink more
than 3 mA of current or die non - function and possible
die failure will result.
This pad is AC coupled
and matched to 50 Ohms.
The backside of the die must be
connected to RF/DC ground.
Interface Schematic
2
Typical Application
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
2-6

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