HMC570 Просмотр технического описания (PDF) - Micross Components

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HMC570

GaAs MMIC I/Q DOWNCONVERTER

Micross Components 

Outline Drawing

2

v03.0711

HMC570

GaAs MMIC I/Q DOWNCONVERTER

17 - 21 GHz

2-5

Die Packaging Information [1]

Standard

Alternate

GP-1 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS 0.004”

3. BOND PAD METALIZATION: GOLD

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. OVERALL DIE SIZE ±0.002

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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