EV1HMC521ALC4(RevA) Просмотр технического описания (PDF) - Analog Devices
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EV1HMC521ALC4 Datasheet PDF : 24 Pages
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HMC521ALC4
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
RF Input Power
LO Input Power
IFx Input Power
IFx Source and Sink Current
Peak Reflow Temperature (Moisture
Sensitivity Level 3 (MSL3))1
Junction Temperature (TJ)
Lifetime at Maximum (TJ)
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 6.22 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
Rating
20 dBm
27 dBm
20 dBm
2 mA
260°C
175°C
>1 × 106 hours
608 mW
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
250 V
500 V
1 See the Ordering Guide.
Data Sheet
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
E-24-11
120
148
°C/W
1 Test Condition 1: JEDEC Standard JESD51-2.
ESD CAUTION
Rev. A | Page 4 of 24
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