HMC520A(RevA) Просмотр технического описания (PDF) - Analog Devices
Номер в каталоге
Компоненты Описание
Список матч
HMC520A Datasheet PDF : 32 Pages
| |||
HMC520A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
RF Input Power
LO Input Power
IF1 and IF2 Input Power
IF Source or Sink Current
Maximum Peak Reflow Temperature
Maximum Junction Temperature (TJ)
Lifetime at Maximum TJ
Moisture Sensitivity Level (MSL)1
Continuous Power Dissipation, PDISS2 (TA = 85°C,
Derate 4.44 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model (FICDM)
Rating
20 dBm
27 dBm
20 dBm
12 mA
260°C
175°C
>1 × 106 Hours
MSL3
400 mW
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
750 V (Class 1B)
1250 V (Class C3)
1 Based on IPC/JEDEC J-STD-20 MSL classifications.
2 PDISS is a theoretical number calculated by (TJ − 85°C)/θJC.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection, junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
θJA
θJC
E-24-11
175°C 225
Unit
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Rev. A | Page 4 of 32
Share Link: 