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HMC981LP3E

ACTIVE BIAS CONTROLLER

Analog Devices 

v01.0411

HMC981LP3E

ACTIVE BIAS CONTROLLER

Absolute Maximum Ratings [1]

VDD

VG2_CONT, VDRAIN

SW, EN, CP_OUT, VGATEFB,

VNEGFB, TRIG_OUT, DISBL_SC,

ISENSE

VDIG

VNEG

VG2

Junction Temperature

Continuous Pdiss (T = 85 °C)

(Derate 19.19 mW/°C above 85 °C)

12V

-0.5V to VDD + 0.5V

-0.5V to VDIG + 0.5V

5.5V

-4V to GND

-0.5V to VDD + 0.5V

125 °C

0.77 Watts

Thermal Resistance (RTH)

(Junction to package bottom)

52.1 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1B

Note that there are two different voltage domains on

HMC981LP3E; a high voltage domain Vdd, and a low voltage

domain VDIG. Take necessary precautions not to violate ABS

MAX ratings of each subdomains.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

13

Package Information

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND

SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK

LOCATED APPROX. AS SHOWN.

7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX.

8. PACKAGE WARP SHALL NOT EXCEED 0.05mm

9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.

Part Number

Package Body Material

Lead Finish

HMC981LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

MSL Rating

MSL1 [2]

Package Marking [1]

H981

XXXX

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