HMC981 Просмотр технического описания (PDF) - Analog Devices

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HMC981

ACTIVE BIAS CONTROLLER

Analog Devices 

v00.0611

HMC981

ACTIVE BIAS CONTROLLER



Mounting & Bonding Techniques for MMICs

The die should be attached directly to the ground plane with epoxy (see HMC general Handling, Mounting , Bonding Note).

Handling Precautions

Follow these precautions to avoid permanent damage.

Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective

bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.

Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.

Static Sensitivity: Follow ESD precautions to protect against ESD strikes.

Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize

inductive pick-up.

General Handling: The chip may be handled by a vacuum collet or with a sharp pair of tweezers.

Mounting

Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the

perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.

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