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ISL97673 Просмотр технического описания (PDF) - Renesas Electronics

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ISL97673 Datasheet PDF : 28 Pages
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ISL97673
Absolute Maximum Ratings (TA = +25°C)
VIN, EN/PWM. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
FAULT . . . . . . . . . . . . . . . . . . . . . VIN - 8.5V to VIN + 0.3V
VDC, COMP, RSET, FPWM, OVP . . . . . . . . . . . . -0.3V to 5.5V
SMBCLK(SCL), SMBDAT(SDA) . . . . . . . . . . . . -0.3V to 5.5V
CH0 - CH5, LX . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 45V
PGND, AGND . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Above voltage ratings are all with respect to AGND pin
ESD Rating
Human Body Model (Tested per JESD22-A114E) . . . . . 3kV
Machine Model (Tested per JESD22-A115-A) . . . . . . . 300V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . 1kV
Thermal Information
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
20 Ld QFN Package (Notes 4, 5, 7) .
40
2.5
Thermal Characterization (Typical)
PSIJT (°C/W)
20 Ld QFN Package (Note 6) . . . . . . . . . . . . 1
Maximum Continuous Junction Temperature . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless
otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach”
features. See TB379.
5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. PSIJT is the PSI junction-to-top thermal characterization parameter. If the package top temperature can be measured with this
rating then the die junction temperature can be estimated more accurately than the JC and JC thermal resistance ratings
7. Refer to JESD51-7 high-effective thermal conductivity board layout for proper via and plane designs.
Electrical Specifications
All specifications below are tested at TA = +25°C; VIN = 12V, EN/PWM = 5V, RSET = 20.1k, unless otherwise noted.
Boldface limits apply over the operating temperature range, -40°C to +85°C.
PARAMETER
SYMBOL
CONDITION
MIN
(Note 8)
TYP
MAX
(Note 8) UNIT
GENERAL
Backlight Supply Voltage
VIN (Note 9) 11 LEDs per channel
4.5
(3.2V/20mA type)
26.5
V
VIN Shutdown Current
Output Voltage
Undervoltage Lock-Out Threshold
Undervoltage Lock-Out Hysteresis
REGULATOR
IVIN_STBY
VOUT
VUVLO
VUVLO_HYS
4.5V < VIN 26V,
FSW = 600kHz
8.55V < VIN 26V,
FSW = 1.2MHz
4.5V < VIN 8.55V,
FSW = 1.2MHz
10
µA
45
V
45
V
VIN/0.19 V
2.6
3.3
V
275
mV
LDO Output Voltage
Standby Current
Active Current
VDC LDO Droop Voltage
Guaranteed Range for EN Input Low
Voltage
VDC
IVDC_STBY
IVDC
VLDO
ENLow
VIN > 6V
EN/PWMI = 0V
EN/PWMI = 5V
VIN > 5.5V, 20mA
4.55
4.8
5
20
5
V
5
µA
mA
200
mV
0.5
V
FN7633 Rev.3.00
Sep 19, 2017
Page 5 of 28

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