SSF2816EB Просмотр технического описания (PDF) - Silikron Semiconductor Co.,LTD.

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SSF2816EB

High Power and current handling capability

Silikron Semiconductor Co.,LTD. 

SSF2816EB

TSSOP-8 PACKAGE INFORMATION

NOTES：

1. Dimensions are inclusive of plating

2. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils.

3. Dimension L is measured in gauge plane.

4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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