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IRF7480MTRPBF

DirectFET® N-Channel Power MOSFET

Infineon Technologies 

IRF7480MTRPbF

Absolute Maximum Ratings

Symbol

Parameter

ID @ TC (top)= 25°C

TC (bottom)= 25°C

Continuous Drain

Current,

VGS

@

10V (double-sided

cooling)

ID @ TC = 25°C

Continuous Drain Current, VGS @ 10V (Silicon Limited)

ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)

IDM

Pulsed Drain Current 

PD @TC = 25°C

Maximum Power Dissipation

Linear Derating Factor

VGS

Gate-to-Source Voltage

TJ

Operating Junction and

TSTG

Storage Temperature Range

Max.

330

217

137

868

96

0.77

± 20

-55 to + 150

Units

A

W

W/°C

V

°C

Avalanche Characteristics

EAS (Thermally limited)

EAS (Thermally limited)

Single Pulse Avalanche Energy 

Single Pulse Avalanche Energy 

IAR

Avalanche Current 

EAR

Repetitive Avalanche Energy 

Thermal Resistance

81

206

mJ

See Fig.15,16, 23a, 23b

A

mJ

Symbol

RJA

RJA

RJA

RJC

RJ-PCB

Parameter

Junction-to-Ambient 

Junction-to-Ambient 

Junction-to-Ambient 

Junction-to-Case 

Junction-to-PCB Mounted

Typ.

–––

12.5

20

–––

0.75

Max.

45

–––

–––

1.3

–––

Units

°C/W

Static @ TJ = 25°C (unless otherwise specified)

Symbol

Parameter

V(BR)DSS

Drain-to-Source Breakdown Voltage

V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient

RDS(on)

Static Drain-to-Source On-Resistance

VGS(th)

IDSS

IGSS

RG

Gate Threshold Voltage

Drain-to-Source Leakage Current

Gate-to-Source Forward Leakage

Gate-to-Source Reverse Leakage

Internal Gate Resistance

Min.

40

–––

–––

–––

2.1

–––

–––

–––

–––

–––

Typ.

–––

30

0.95

1.60

3.0

–––

–––

–––

–––

0.81

Max. Units

Conditions

––– V VGS = 0V, ID = 250µA

––– mV/°C Reference to 25°C, ID = 1.0mA

1.20

–––

m

VGS = 10V, ID = 132A 

VGS = 6.0V, ID = 66A 

3.9

V VDS = VGS, ID = 150µA

1.0

150

µA

VDS = 40V, VGS = 0V

VDS = 40V, VGS = 0V, TJ = 125°C

100

-100

nA

VGS = 20V

VGS = -20V

––– 

Notes:

 Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.

 Used double sided cooling , mounting pad with large heatsink.

 TC measured with thermocouple mounted to top (Drain) of part.

 Surface mounted on 1 in. square Cu

board (still air).

2

 Mounted to a PCB with small clip

heatsink (still air)

 Mounted on minimum footprint full size

board with metalized back and with

small clip heatsink (still air)

2016-5-4

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