TGA1073C-EPU Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA1073C-EPU Datasheet PDF : 5 Pages
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Advance Product Information
Mechanical Characteristics
7
6
1
4
8
5
2
3
Units: millimeters (inches)
Thickness: 0.1016 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.0508 (0.002)
Bond Pad #1
Bond Pad #2
Bond Pads #3, 4, 5
Bond Pads #6, 7, 8
(RF Input)
(RF Output)
(VD)
(VG)
0.100 x 0.130 (0.004 x .005)
0.100 x 0.130 (0.004 x .005)
0.100 x 0.100 (0.004 x .004)
0.100 x 0.100 (0.004 x .004)
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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