BUK7880-55 Просмотр технического описания (PDF) - NXP Semiconductors.
Номер в каталоге
Компоненты Описание
Список матч
BUK7880-55 Datasheet PDF : 12 Pages
| |||
NXP Semiconductors
BUK7880-55
N-channel TrenchMOS standard level FET
11. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
SOT223
D
B
E
A
X
c
y
HE
b1
4
vM A
A1
1
2
3
e1
bp
e
wM B
Q
A
Lp
detail X
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
b1
c
D
E
e
e1 HE Lp
Q
v
w
y
mm
1.8 0.10 0.80 3.1 0.32 6.7
1.5 0.01 0.60 2.9 0.22 6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1 0.95
0.7 0.85
0.2
0.1
0.1
OUTLINE
VERSION
IEC
SOT223
REFERENCES
JEDEC
JEITA
SC-73
Fig. 16. Package outline SC-73 (SOT223)
BUK7880-55
All information provided in this document is subject to legal disclaimers.
Product data sheet
16 March 2016
EUROPEAN
PROJECTION
ISSUE DATE
04-11-10
06-03-16
© NXP Semiconductors N.V. 2016. All rights reserved
8 / 11
Share Link: 