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AFBR-5803Z

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low-Cost 1 × 9 Package Style

Broadcom Corporation 

AFBR-5803Z/5803TZ/5803AZ/5803ATZ

Data Sheet

Transceiver Jitter Performance

The Broadcom 1300-nm transceivers are designed to operate

per the system jitter allocations stated in Tables E1 of Annexes

E of the FDDI PMD and LCF-PMD standards.

The Broadcom 1300-nm transmitters will tolerate the

worst-case input electrical jitter allowed in these tables

without violating the worst case output jitter requirements of

Sections 8.1 Active Output Interface of the FDDI PMD and

LCF-PMD standards.

The Broadcom 1300-nm receivers will tolerate the worst-case

input optical jitter allowed in Sections 8.2 Active Input

Interface of the FDDI PMD and LCF-PMD standards without

violating the worst case output electrical jitter allowed in the

Tables E1 of the Annexes E.

The jitter specifications stated in the following 1300-nm

transceiver specification tables are derived from the values in

Tables E1 of Annexes E. They represent the worst-case jitter

contribution that the transceivers are allowed to make to the

overall system jitter without violating the Annex E allocation

example. In practice the typical contribution of the Broadcom

transceivers is well below these maximum allowed amounts.

Recommended Handling Precautions

Broadcom recommends that normal static precautions be

taken in the handling and assembly of these transceivers to

prevent damage that may be induced by electrostatic

discharge (ESD). The AFBR-5800 series of transceivers meet

MIL-STD-883C Method 3015.4 Class 2 products.

Care should be used to avoid shorting the receiver data or

signal detect outputs directly to ground without proper

current limiting impedance.

Board Layout – Decoupling Circuit and

Ground Planes

It is important to take care in the layout of your circuit board to

achieve optimum performance from these transceivers.

Figure 9 provides a good example of a schematic for a power

supply decoupling circuit that works well with these parts. It is

further recommended that a contiguous ground plane be

provided in the circuit board directly under the transceiver to

provide a low inductance ground for signal return current. This

recommendation is in keeping with good high-frequency

board layout practices.

Board Layout – Hole Pattern

The Broadcom transceiver complies with the circuit board

“Common Transceiver Footprint” hole pattern defined in the

original multisource announcement that defined the 1 × 9

package style. This drawing is reproduced in Figure 10 with the

addition of ANSI Y14.5M compliant dimensioning to be used as

a guide in the mechanical layout of your circuit board.

Board Layout – Mechanical

For applications providing a choice of either a duplex SC or a

duplex ST connector interface, while using the same pinout on

the printed circuit board, the ST port needs to protrude from

the chassis panel a minimum of 9.53 mm for sufficient

clearance to install the ST connector.

See Figure 11 for a mechanical layout detailing the

recommended location of the duplex SC and duplex ST

transceiver packages in relation to the chassis panel.

Solder and Wash Process Compatibility

The transceivers are delivered with protective process plugs

inserted into the duplex SC or duplex ST connector receptacle.

This process plug protects the optical subassemblies during

wave solder and aqueous wash processing and acts as a dust

cover during shipping.

These transceivers are compatible with either industry

standard wave or hand solder processes.

Shipping Container

The transceiver is packaged in a shipping container designed

to protect it from mechanical and ESD damage during

shipment or storage.

Broadcom

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