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MS5D3031

SILICON DIODE

Fuji Electric 

Installation

・Soldering involves temperatures which exceed the device storage temperature rating. To avoid

device damage and to ensure reliability, observe the following guidelines from the quality

assurance standard.

Table 1: Solder temperature and duration

Method

Flow

Solder

temperature

260±5℃

Duration

10±1sec

Soldering iron 350±10℃

3.5±0.5sec

・The immersion depth of the lead should basically be up to the lead stopper and the distance

should be a maximum of 1.5mm from the device.

・When flow-soldering, be careful to avoid immersing the package in the solder bath.

・Refer to the following torque reference When mounting the device on a heat sink. Excess

torque applied to the mounting screw causes damage to the device and weak torque will

increase the thermal resistance, both of which conditions may destroy the device.

Table 2:Recommended tightening torque

Package style Screw Recommended tightening torque

TO-3PF

M3

0.4～0.6N・m

・The heat sink should have a flatness within ±30μm and roughness within 10μm. Also, keep

the tightening torque within the limits of this specification.

・Improper handling may cause isolation breakdown leading to a critical accident.

・We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is

important to evenly apply the compound and to eliminate any air voids.

Storage

・The Diodes must be stored at a standard temperature of 5 to 35℃ and relative humidity of 45

to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only

deionized water or boiled water, since the chlorine in tap water may corrode the leads.

・The Diodes should not be subjected to rapid changes in temperature to avoid condensation on

the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is

steady.

・The Diodes should not be stored on top of each other, since this may cause excessive external

force on the case.

・The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may

cause presoldered connections to go fail during later processing.

・The Diodes should be stored in antistatic containers or shipping bags.

Fuji Electric Device Technology Co.,Ltd.

MS5D3031 7/12

H04-004-03a

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