RT5047 Просмотр технического описания (PDF) - Richtek Technology
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RT5047 Datasheet PDF : 16 Pages
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RT5047
DC Current
The RT5047 can handle up to 500mA during
continuous operation.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature.
The maximum power dissipation can be calculated by
the following formula :
PD(MAX) = (TJ(MAX) TA) / JA
where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and JA is the junction to
ambient thermal resistance.For recommended
operating condition specifications, the maximum
junction temperature is 125C. The junction to ambient
thermal resistance, JA, is layout dependent. For
SOP-8 (Exposed Pad) package, the thermal resistance,
JA, is 29C/W on a standard JEDEC 51-7 four-layer
thermal test board. The maximum power dissipation at
TA = 25C can be calculated by the following formula :
PD(MAX) = (125C 25C) / (29C/W) = 3.44W for
SOP-8 (Exposed Pad) package
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 3
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
Four-Layer PCB
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curve of Maximum Power
Dissipation
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is a registered trademark of Richtek Technology Corporation.
DS5047-00 March 2015
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