EMIF06-MSD02N16(2008) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге

Компоненты Описание

Список матч

EMIF06-MSD02N16
(Rev.:2008)

6-line IPAD™, EMI filter and ESD protection

STMicroelectronics 

EMIF06-MSD02N16

4

Package information

Package information

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Table 3.

E

Pin 1

Index area

E2

k

Micro QFN 3.5x1.2 16L dimensions

Dimensions

Ref.

Millimeters

Inches

1

D

D2

b

e

A

A1

M

L

1 L1

b1

Min. Typ. Max. Min. Typ. Max.

A 0.45 0.50 0.55 0.018 0.020 0.022

A1 0.00

0.05 0.000

0.002

b 0.15 0.20 0.25 0.006 0.008 0.010

b1 0.25 0.30 0.35 0.010 0.012 0.014

D 3.45 3.50 3.55 0.136 0.138 0.140

D2 2.70 2.80 2.90 0.106 0.110 0.114

E 1.15 1.20 1.25 0.045 0.047 0.049

E2 0.25 0.30 0.40 0.010 0.012 0.016

e

0.40

0.016

k

0.20

0.008

L 0.20 0.25 0.30 0.008 0.010 0.012

L1

0.15

0.006

M

0.20

0.008

Figure 13. Micro QFN 3.5x1.2 16L

Figure 14. Marking

footprint (dimensions in mm)

3.00

Dot : Pin 1 Identification

N6 = Marking

1.6

0.70

2.30

0.40

0.30

0.45

0.20

N6

7/12

Share Link: