datasheetbank_Logo
Технический паспорт Поисковая и бесплатно техническое описание Скачать

EMIF06-MSD02N16(2008) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
Список матч
EMIF06-MSD02N16
(Rev.:2008)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
EMIF06-MSD02N16 Datasheet PDF : 12 Pages
First Prev 11 12
EMIF06-MSD02N16
Ordering information
5.5
Reflow profile
Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
6
Ordering information
Table 4. Ordering information
Order code
Marking Package
Weight
EMIF06-MSDN16
N6(1)
Micro QFN
6.17 mg
1. The marking can be rotated by 90° to differentiate assembly location
Base qty
3000
Delivery mode
Tape and reel (7”)
7
Revision history
Table 5. Document revision history
Date
Revision
21-Nov-2008
1
Initial release.
Changes
11/12

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]