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HPMX-5002-STR Просмотр технического описания (PDF) - HP => Agilent Technologies

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HPMX-5002-STR
HP
HP => Agilent Technologies HP
HPMX-5002-STR Datasheet PDF : 14 Pages
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HPMX-5002 Functional Block Diagram
IFIP1
IF1
DMOD
IFOP1
DMODOP
BUF1
BUF2
TCSET
IP1
OSCOP
OSCOPB
90/216
φ
FREQ.
DET.
RSSI
CHARGE
PUMP
LOCK
DET.
DATA
SLICER
9/12/16
BIAS
CONTROL
VCOADJ VCOB
PFD
VCOA
DIV3
LKDET
PLL
XLO
RX
DATAOP
RSSI
DIV2
DIV1
REF
BGR
HPMX-5002 Absolute Maximum Ratings[1]
Symbol
Parameter
Units Min. Max.
Thermal Resistance[2]:
Pdiss
TSTG
VCC Supply Voltage
Voltage at any Pin[4]
Power Dissipation[2,3]
Junction Temperature
Storage Temperature
V
-0.2
7.5
θjc = 80°C/W
V
-0.2 VCC + 0.2 Notes:
mW
°C
°C
-55
200
+110
+125
1. Operation of this device in excess
of any of these parameters may
cause permanent damage.
2. Tcase = 25°C
3. Derate at 10 mW/°C for Tcase > 90°C
4. Except CMOS logic inputs, see
Summary Characterization
Information Table.
HPMX-5002 Guaranteed Electrical Specifications
Unless otherwise noted, all parameters are guaranteed under the following conditions: 2.7 V < VCC < 5.5 V.
Test results are based upon use of networks shown in test diagram (see Figure 1). fin = 110.592 MHz.
Typical values are for VCCX = 3.0 V, TA = 25°C.
Symbol Parameters and Test Conditions
Units Min. Typ. Max.
Iccx
GIF1
VDATOP
VDATOP
Total Vccx supply current
(PLL locked)
(PLL locked)
Charge pump current
Charge pump current
Mixer power gain from
IP1 to IF1, external load
impedance of 600
Data slicer output level
Data slicer output level
RX mode
PLL mode
TX “flywheel” mode
Standby mode
high current mode
low current mode
input matched to 50
Logic ‘0’
Logic ‘1’
mA
21
mA
16
mA
9
µA
µA
400
550
µA
30
50
dB
5
8
V
V
Vccx- 0.3
27
20
11.5
100
1000
100
0.3
7-107

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