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SPT7610SIQ

8-BIT, 1 GSPS FLASH A/D CONVERTER

Signal Processing Technologies 

THERMAL MANAGEMENT

Adequate heat sinking and air flow must be provided to

keep the die temperature below +150 °C. This device is

packaged with the cavity up (the die is on the bottom of

the package). Therefore, SPT recommends that the

device be heat sinked by contacting the bottom of the

package through a hole in the circuit board.

The thermal coefficients of the SPT7610 (44L cerquad)

are as follows:

θja = +78 °C/W (junction to ambient in

still air with no heat sink)

θjc = +4 °C/W (junction to case)

SUBCIRCUIT SCHEMATICS

Figure 3A – Input Circuit

AGND

Figure 3B – Output Circuit

AGND

DGND

Figure 3C – Clock Input

AGND

VIN

Vr

CLK

Data Out

CLK

VEE

VEE

SPT

8

SPT7610

12/19/00

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