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W6662CF Просмотр технического описания (PDF) - Winbond

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W6662CF
Winbond
Winbond Winbond
W6662CF Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
Preliminary W6662CF
8.2. Decoupling Circuit
Figure 8-2 shows the decoupling capacitor request on the W6662 system board to reduce noise and
distortion, 0.1 µF capacitor must as near to the pin as possible. The analog power source and digital
power source (DRVDD) had better regulated by different regulator, the analog ground and digital
ground (DRVSS) must separated and must connected only at one point near the power supplier. All
the analog power pins must connected as short as possible and all the analog ground pins must
connected as short as possible on the PC board. Termination resistor must added near the W6662
chip on the CDSCK1, CDSCK2 and ADCCLK input pin.
10uF +
0.1uF
0.1uF
0.1uF
0.1uF
1uF +
0.1uF
0.1uF
AVDD
10uF +
0.1uF
(Analog Part)
VRDT
(Digital Part)
VRDT
VDRB
W6662
CDSCK1
(other pins are not shown)
VRDB
VRDC
CDSCK2
VREF
ADCCLK
CISREF
AVDD
AVSS
(near power source)
DRVDD
DRVSS
Rterm
Rterm
Rterm
0.1uF
DRVDD
+ 10uF
Fig. 8-2 Decoupling Capacitor Circuit of W6662 Device.
- 17 -
Publication Release Date: December 1998
Revision A1

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