PH9025L Просмотр технического описания (PDF) - NXP Semiconductors.
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PH9025L Datasheet PDF : 12 Pages
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NXP Semiconductors
7. Package outline
PH9025L
N-channel TrenchMOS logic level FET
Plastic single-ended surface-mounted package (LFPAK); 4 leads
SOT669
L1
HD
E
A
A2
C
b2
c2
mounting
base
D1
L2
1
2
3
4
e
b
wM A
1/2 e
X
c
E1
b3
b4
A
A1 C
detail X
(A 3)
θ
L
yC
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1 A2 A3
b
b2 b3 b4
c
c2
D (1)
D1(1)
max
E(1)
E1(1)
e
H
L L1 L2 w
y
θ
mm
1.20
1.01
0.15
0.00
1.10
0.95
0.25
0.50
0.35
4.41
3.62
2.2
2.0
0.9
0.7
0.25
0.19
0.30
0.24
4.10
3.80
4.20
5.0
4.8
3.3
3.1
1.27
6.2 0.85 1.3
5.8 0.40 0.8
1.3
0.8
0.25
0.1
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT669
MO-235
EUROPEAN
PROJECTION
ISSUE DATE
04-10-13
06-03-16
Fig 15. Package outline SOT669 (LFPAK)
PH9025L_1
Product data sheet
Rev. 01 — 23 August 2007
© NXP B.V. 2007. All rights reserved.
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