FMA3007 Просмотр технического описания (PDF) - Filtronic PLC

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FMA3007

2-20GHZ BROADBAND MMIC AMPLIFIER

Filtronic PLC 

PREFERRED ASSEMBLY INSTRUCTIONS:

GaAs devices are fragile and should be

handled with great care. Specially designed

collets should be used where possible.

The recommended die attach is gold/tin

eutectic solder under a nitrogen atmosphere.

Stage temperature should be 280-290°C;

maximum time at temperature is one minute.

The recommended wire bond method is

thermo-compression wedge bonding with 0.7

or 1.0 mil (0.018 or 0.025 mm) gold wire.

Stage temperature should be 250-260°C.

Bonds should be made from the die first and

then to the mounting substrate or package.

The physical length of the bondwires should be

minimised especially when making RF or

ground connections.

FMA3007

Production Datasheet v3.0

ORDERING INFORMATION:

PART NUMBER

FMA3007

DESCRIPTION

Die in Waffle-pack

(Gel-pak available on request)

HANDLING

PRECAUTIONS:

To avoid damage to the devices care should

be exercised during handling. Proper

Electrostatic Discharge (ESD) precautions

should be observed at all stages of storage,

handling, assembly, and testing. These

devices should be treated as Class 0 (0-250 V)

as defined in JEDEC Standard No. 22-A114.

Further information on ESD control measures

can be found in MIL-STD-1686 and MIL-

HDBK-263.

APPLICATION NOTES & DESIGN DATA:

Application Notes and design data including S-

parameters, noise data are available on

request.

DISCLAIMERS:

This product is not designed for use in any

space based or life sustaining/supporting

equipment.

8

Tel: +44 (0) 1325 301111

Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Fax: +44 (0) 1325 306177

Email: sales@filcs.com

Website: www.filtronic.com

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