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FMA3007 Просмотр технического описания (PDF) - Filtronic PLC

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FMA3007
Filtronic
Filtronic PLC Filtronic
FMA3007 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
ABSOLUTE MAXIMUM RATINGS:
PARAMETER SYMBOL
ABSOLUTE
MAXIMUM
Max Input Power
Pin
+20dBm
Gate Voltage
VG1
-2V
Drain Voltage
VDD
+10V
Total Power
Ptot
tbd
Dissipation
Gain Compression
Thermal Resistivity
Comp
θJC
tbd
38°C/W
Operating Temp
Toper
-40°C to +85°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
A
IH
G
FMA3007
Production Datasheet v3.0
PAD PAD
REF NAME
DESCRIPTION
PIN
COORDINATES
(µm)
A
RF in
RF in
(140, 1153)
B
VDP
(+Ve) Temperature
Monitoring Diode
(2097, 140)
C
VDN
(-Ve) Temperature
Monitoring Diode
(2321, 140)
D
GND
Ground
(2545, 140)
E
VG1
Gate Control
(2769, 140)
F
VG2
Gain Control
(2993, 140)
G
RF Out
RF Out
(3004, 1141)
H
GND
Ground
(2800, 1650)
I
VDD
Drain Voltage
(2550, 1650)
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
B CDE F
DIE SIZE (µm)
3150 x 1780
DIE THICKNESS (µm)
MIN. BOND PAD PITCH
(µm)
100
220
MIN. BOND PAD OPENING
(µm x µm )
100 x 100
Tel: +44 (0) 1325 301111
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com

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