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STF6N80K5 Просмотр технического описания (PDF) - STMicroelectronics

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STF6N80K5 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Electrical characteristics
2
Electrical characteristics
STF6N80K5, STFI6N80K5
(TCASE = 25 °C unless otherwise specified).
Symbol
Parameter
Table 4. On/off states
Test conditions
V(BR)DSS
Drain-source breakdown
voltage (VGS = 0)
ID = 1 mA
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = 800 V
VDS = 800 V, Tj = 125 °C(1)
IGSS
Gate body leakage current
(VDS = 0)
VGS = ± 20 V
VGS(th) Gate threshold voltage
VDS = VGS, ID = 100 µA
Static drain-source
RDS(on) on-resistance
VGS = 10 V, ID = 2 A
1. Defined by design, not subject to production test.
Min. Typ. Max. Unit
800
V
1 µA
50 µA
±10 µA
3
4
5
V
1.3 1.6
Table 5. Dynamic
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 100 V,
f = 1 MHz,
VGS = 0
- 270 - pF
- 25 - pF
- 0.7 - pF
Co(tr)(1)
Equivalent capacitance time
related
- 38 - pF
Co(er)(2)
Equivalent capacitance
energy related
VGS = 0, VDS = from 0 to 640 V
- 16 - pF
RG Intrinsic gate resistance
f = 1 MHz, ID = 0
- 7.5 -
Qg Total gate charge
Qgs Gate-source charge
Qgd Gate-drain charge
VDD = 640 V, ID = 4.5 A
VGS = 10 V
(see Figure 15: Gate charge
test circuit)
- 13 - nC
- 2.1 - nC
- 9.6 - nC
1. Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when
VDS increases from 0 to 80% VDSS
2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss
when VDS increases from 0 to 80% VDSS
4/15
DocID024664 Rev 4

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