B57861S Просмотр технического описания (PDF) - Unspecified

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B57861S

NTC thermistors for temperature measurement

Unspecified 

Temperature measurement

Miniature sensors with bendable wires

B57861S

S861

8

Placement and orientation of SMD NTC thermistors on PCB

a) Component placement

It is recommended that the PC board

should be held by means of some

adequate supporting pins such as

shown left to prevent the SMDs from

being damaged or cracked.

b) Cracks

c) Component orientation

When placing a component near an

area which is apt to bend or a grid

groove on the PC board, it is advisable

to have both electrodes subjected to

uniform stress, or to position the

component's electrodes at right angles

to the grid groove or bending line (see

c) Component orientation).

Choose a mounting position that

minimizes the stress imposed on the

chip during flexing or bending of the

board.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 15 of 20

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