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B57861S Просмотр технического описания (PDF) - Unspecified

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B57861S Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Temperature measurement
Miniature sensors with bendable wires
Solder joint profiles for silver/nickel/tin terminations
B57861S
S861
1.3.3 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size A
B
C
inch/mm
0402/1005 0.6
0.6
1.7
0603/1608 1.0
1.0
3.0
0805/2012 1.3
1.2
3.4
1206/3216 1.8
1.2
4.5
1.3.4 Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 20

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