W83176R-732 Просмотр технического описания (PDF) - Winbond

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Компоненты Описание

Список матч

W83176R-732

Winbond 2 DIMM DDR ZERO DELAY BUFFER

Winbond 

W83176R-732/W83176G-732

2 DIMM DDR ZERO DELAY buffer for Sis chipset

9. ORDERING INFORMATION

Part Number

W83176R-732

W83176G-732

Package Type

28 PIN SSOP

28 PIN SSOP

(Lead free package)

Production Flow

Commercial, 0°C to +70°C

Commercial, 0°C to +70°C

10. HOW TO READ THE TOP MARKING

W83176R-732

28051234

442GB

W83176G-732

28051234

442GB

1st line: Winbond logo and the type number:

Normal package: W83176R-732, Lead free package:W83176G-732

2nd line: Tracking code 2 8051234

2: wafers manufactured in Winbond FAB 2

8051234: wafer production series lot number

3rd line: Tracking code 342 G B

442: packages made in '2003, week 42

G: assembly house ID; O means OSE, G means GR

B: IC revision

All the trade marks of products and companies mentioned in this data sheet belong to their

respective owners.

-7-

Publication Release Date: March, 2006

Revision 1.1

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