W83176R-732 Просмотр технического описания (PDF) - Winbond

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W83176R-732

Winbond 2 DIMM DDR ZERO DELAY BUFFER

Winbond 

W83176R-732/W83176G-732

2 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET

11. PACKAGE DRAWING AND DIMENSIONS

28pin 209mil

D

2

15

HE E

DTEAIL A

1

14

DIMENSION IN MM DIMENSION IN INCH

SYMBOL

MIN. NOM MAX. MIN. NOM MAX.

A

2.00

0.079

A1 0.05

0.002

A2 1.65 1.75 1.85 0.065 0.069 0.073

b 0.22

0.38 0.009

0.015

c 0.09

0.25 0.004

0.010

D 9.90 10.20 10.50 0.389 0.401 0.413

E 5.00 5.30 5.60 0.197 0.209 0.220

HE 7.40 7.80 8.20 0.291 0.307 0.323

e

0.65

0.0256

L 0.55 0.75 0.95 0.021 0.030 0.037

L1

1.25

0.050

Y

0.10

0.004

θ0

80

8

SEATING PLANE

Y

e

b

A2 A

A1

θL

DETAIL A L1

SEATING PLANE

Please note that all data and specifications are subject to change without notice. All the trade marks

of products and companies mentioned in this data sheet belong to their respective owners.

-8-

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