25Q16 Просмотр технического описания (PDF) - Winbond

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Компоненты Описание

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25Q16

8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

W25Q80, W25Q16, W25Q32

6. PIN CONFIGURATION SOIC 300-MIL

Figure 1c. W25Q16 and W25Q32 Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)

7. PIN DESCRIPTION SOIC 300-MIL

PAD NO.

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

PAD NAME

/HOLD (IO3)

VCC

N/C

N/C

N/C

N/C

/CS

DO (IO1)

/WP (IO2)

GND

N/C

N/C

N/C

N/C

DI (IO0)

CLK

I/O

FUNCTION

I/O

Hold Input (Data Input Output 3)*2

Power Supply

No Connect

No Connect

No Connect

No Connect

I

Chip Select Input

I/O

Data Output (Data Input Output 1)*1

I/O

Write Protect Input (Data Input Output 2)*2

Ground

No Connect

No Connect

No Connect

No Connect

I/O

Data Input (Data Input Output 0)*1

I

Serial Clock Input

*1 IO0 and IO1 are used for Dual and Quad instructions

*2 IO0 – IO3 are used for Quad instructions

Publication Release Date: September 26, 2007

-7-

Preliminary - Revision B

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