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25Q16 Просмотр технического описания (PDF) - Winbond

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25Q16 Datasheet PDF : 61 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
W25Q80, W25Q16, W25Q32
12.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 53
12.2 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 54
12.3 8-contact 6x5 WSON (Package Code ZP) ................................................................... 55
12.4 8-contact 6x5 WSON Cont’d. ....................................................................................... 56
12.5 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 57
13. ORDERING INFORMATION .................................................................................................... 58
13.1 Valid Part Numbers and Top Side Marking .................................................................. 59
14. REVISION HISTORY ................................................................................................................ 60
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