U631H256XS Просмотр технического описания (PDF) - Simtek Corporation
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U631H256XS Datasheet PDF : 15 Pages
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Test Configuration for Functional Check
A0
A1
VCCw
A2
A3
A4
DQ0
A5
DQ1
VIH
A6
A7
DQ2
A8
DQ3
A9
DQ4
A10
DQ5
VIL
A11
A12
DQ6
A13
DQ7
A14
E
W
G
VSS
U631H256XS
5V
480
VO
30 pF v
255
v: In measurement of tdis-times and ten-times the capacitance is 5 pF.
w: Between VCC and VSS must be connected a high frequency bypass capacitor 0.1 μF to avoid disturbances.
Capacitancee
Conditions
Symbol
Input Capacitance
Output Capacitance
VCC = 5.0 V
CI
VI
= VSS
f
= 1 MHz
Ta
= 25 °C
CO
All pins not under test must be connected with ground by capacitors.
Min.
Max.
8
7
Unit
pF
pF
Bonding Instructions
The U631H256XS has 29 relevant bond pads and 6 additional pads.
The 6 additional pads must not be bonded.
Refer to the bond pad location and identification table for a complete list of pads and coordinates.
Always both VCC pads have to be connected.
It is mandatory to use two bond wires on VCC and VSS doublebond pads for noise immunity.
The backside of the die is connected to VCC and can be contacted with the substrate in case of the same potential.
March 31, 2006
STK Control #ML0044
9
Rev 1.0
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