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STTH6004W Просмотр технического описания (PDF) - STMicroelectronics

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STTH6004W
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STTH6004W Datasheet PDF : 6 Pages
1 2 3 4 5 6
Figure 12: DO-247 Package mechanical data
V
V
Dia
H
A
L5
L
L3
V2
L2
F2 L1
F3
L4
D
F
G
M
E
STTH6004W
DIMENSIONS
REF. Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 4.85
5.15 0.191
0.203
D 2.20
2.60 0.086
0.102
E 0.40
0.80 0.015
0.031
F 1.00
1.40 0.039
0.055
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1 3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M 2.00
3.00 0.078
0.118
V
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 7: Ordering information
Ordering type
STTH6004W
Marking
STTH6004W
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 Nm.
Maximum torque value: 1.0 Nm.
Table 8: Revision history
Date
Revision
18-Oct-2005
1
Package
DO-247
First issue
Weight
4.40 g
Base qty Delivery mode
30
Tube
Description of Changes
5/6

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